ORDYL SY 300 is a solvent type permanent dry film for special MEMS applications. The Ordyl SY 300 in connection with his auxiliary product line CFC free: Ordyl SY Developer and Ordyl SY Rinse, offer the following performances:
Ordyl SY 300 could be used for sealing application, due to the capability to be pressed together with a top plate.
We recommend a minimum hold time after exposure of at least 15 minutes.
SY 300 could be develop with spray, paddle or dipping method.
Using Ordyl SY Developer in dipping process at room temperature maintain the Break Point between 60% and 80% depend on application. Use Ordyl SY Rinse to remove scum and clean the surface.
If final rinse with DI water is necessary an intermediate rinse with IPA is suggested.
After developing is necessary a post-baking at 150°C for 30 - 60min.
Ordyl SY 300 could be stripped only before post bake.
For the test we used a 55 μm thickness dry film, laminated on SiO2 wafer.
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